The U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies
This NOFO anticipates funding multiple awards across five research and development (R&D) areas with the potential for follow-on funding for prototyping activities
Value:
Total Funding: $1.6 billion
Notable Conditions:
Equipment, Tools, Processes, and Process Integration
Power Delivery and Thermal Management
Connector Technology, Including Photonics and Radio Frequency (RF)
Chiplets Ecosystem
Co-design/Electronic Design Automation (EDA)
Beneficiaries:
United States manufacturers in semiconductor industry
